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High Frequency PCB

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What is High-Frequency PCB?

A high-frequency PCB refers to a special PCB that has a frequency range of 500MHz to 2GHz. This is a very high-frequency range that is not achievable in standard PCBs, which is why these PCBs are used for particular purposes where high-frequency signals are transmitted. High-frequency PCB is a circuit board produced on microwave substrate copper clad board using part of ordinary rigid circuit board manufacturing methods or using unique processing methods. Due to high frequency, communication and signal transmission are carried out at a faster rate. High-frequency PCBs’ primary use is in wireless communications, including satellites, telecommunication, and radar systems.
Why High-Frequency PCB?
When it comes to transmitting a signal at a higher frequency, there are many chances of losses, delays, and distortion in the signal. Thus, if we use a standard PCB for high-speed or high-frequency purposes, the results will not be optimum. The signals might get lost, or there could be huge losses after receiving the signal.
Furthermore, we cannot eliminate the use of high-frequency signals in the circuit because it’s the future. Nowadays, wireless transmission is widespread, and the best example is a Wi-Fi router working at your home. Some complex components and switches need signals faster, so the signal has a higher frequency. In simple words, high-frequency applications are increasing day by day because of the advantages that it offers. Thus, there is no choice to go for low-frequency signals to avoid the problem.
The only solution to these problems is the high-frequency PCB. A high-frequency is made of unique materials and has some specific features that allow it to transfer high-frequency signals with minimal loss. The High-frequency PCB is ideal for high-speed applications.

Materials for High-Frequency PCB
The materials that are used for high-frequency PCBs have unique qualities. If the material you have chosen is correct, it will offer the optimum results. Before you select any material, you need to go through some specifications to know whether the material is suitable for the application or not.
The important factors that you need to look at are,
1. Dielectric Constant(DK)
2. Dissipation Factor(DF)
3. Coefficient of Thermal Expansion
4. Moisture Absorption
Dielectric Constant(DK)
Dielectric constant (Dk) is also known as Relative Permittivity (Er). It is a crucial factor that should be considered while selecting the material for PCB, especially in high-frequency PCBs. When you read the value of dielectric contact of the material, it seems constant, and many people consider it a continuous value. In reality, it is a variable quantity that varies with the frequency. Typically, the value of the dielectric contact decreases with the increase in frequency. The dielectric constant of a high-frequency PCB should be small to prevent delays in signal transmission. Moreover, the constant value should remain stable for a wide range of frequencies to deliver the desired results.

Dissipation Factor(DF)
Dissipation factor (Df) is also termed as dielectric loss tangent. It is a significant factor in high-speed designs. It is the measure of signal loss during transmission. A low or no loss is desired in every case, including high-frequency applications. Df's value should be lower so that it cannot attenuate the signal or create a significant loss. The lower the dissipation factor, the better it is. At higher frequencies, the loss is higher because the dielectric material absorbs more energy. Thus, if the high-frequency PCB materials are not picked wisely, there will be a loss of signals.

Coefficient of Thermal Expansion
While selecting the material for a high-frequency PCB, thermal expansion's coefficient is an essential factor to look at. Above the base layer of the PCB, there is a copper layer, which is responsible for the conduction. If anything happens to that layer, the PCB will not work or provide the desired results. The coefficient is analyzed wisely, and the material with the coefficient of a thermal expansion near to copper is selected. This ensures the expansion and contraction of the base material with the top copper layer. Otherwise, due to a massive difference in both the materials' coefficients, there can be a discontinuity in the electric connection. The top copper layer stays intact in a high-frequency PCB irrespective of the hot or cold temperature. Thus, the PCB can last for a long time and provide the desired results.
Dielectric Constant(DK)
The PCB material should not absorb too much moisture because it can increase the losses and delays in the transmission. If the humidity is absorbed too much, the dielectric constant and loss tangent is also affected.
Some Common High-frequency PCB Materials
By considering the above factors, some common materials that are used for high-frequency PCBs. Some of them are:
. High Performing FR-4
. PTFE
. Ceramic-filled PTFE
. Ceramic-fille Hydrocarbon
. E-fibre glas
Teflon is one of the best and most widely used materials for high-frequency PCBs. It can offer stable and optimum results. But it is more expensive as compared to FR-4. There are some popular and trusted manufacturers of high-frequency PCB materials; some of them are:
. Rogers (RO03001, RO03003, RO3010, RO4350B, RO4450B, RO4350 HF, RO4003)
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Isola IS620 E-fibre glass
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Isola FR408, FR 408 HR
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Isola IS 415
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Arlon 85N
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Taconic RF-35 Ceramic
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Taconic TLX
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GIL Taconic
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Nelco N4000-12/N4000-12SI
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Nelco N4000-13EP/N4000-13EPSI
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Nelco N8000
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Hitachi LX-67Y, FX II
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Getek
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Panasonic Megtron +
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Panasonic R2125
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Panasonic Megtron VI
Double Sided PCB Board Prototype
Double Sided PCB Prototype Fabrication

As we all know, the double-sided circuit board is a very important PCB in the printed circuit board. The market has double-sided metal-based PCB, Hi-Tg heavy copper circuit board, double-sided flexible circuit board, and double-sided high-frequency circuit board.
The most common surface treatment used in manufacturing double-sided PCB board prototypes is OSP, immersion gold, lead-free tin spraying, etc.
The double-sided PCB with a lead-free tin spraying process has the advantages of beautiful appearance, white pads, easy-to-tin pads, ease-to-solder, and low price.
The Cheapest and The Most Expensive High-Frequency PCB Material

Material | Dielectric Constant |
RO4350B | 3.48±0.05@10 GHz |
RO4003C | 3.38±@10 GHz |
Ro3003 | 3.00±0.04@10 GHz |
Ro3010 | 10.2±0.03@10 GHz |
RT5880 | 2.20±0.02@10 GHz |
Several common high frequency circuit board material parameters
Material for high frequency boards | ![]() |
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°C | ppm/°C | @10GHz | KV/mm | MΩ | W/m*K | @10GHz | °C | N/mm | |
Rogers 4350B HF material | 280° | 32 | 3,5 | 31 | 5,7 x 10^9 | 0,69 | 0,0037 | 390° | 0,9 |
ISOLA IS620 E-fibre glas | 220° | 55 | 4,5* | – | 2,8 x 10^6 | – | 0,0080* | – | 1,2 |
Taconic RF-35 Ceramic | 315° | 64 | 3,5** | – | 1,5 x 10^8 | 0,24 | 0,0018** | – | 1,8 |
Taconic TLX PTFE | – | 135 | 2,5 | – | 1 x 10^7 | 0,19 | 0,0019 | – | 2,1 |
Taconic TLC PTFE | – | 70 | 3,2 | – | 1 x 10^7 | 0,24 | – | – | 2,1 |
Rogers RO3001 Bonding Film for PTFE | 160° | – | 2,3 | 98 | 1 x 10^9 | 0,22 | 0,0030 | – | 2,1 |
Rogers RO3003 PTFE ceramic-filled | – | 25 | 3,0 | – | 1 x 10^7 | 0,50 | 0,0013 | 500° | 2,2 |
Rogers RO3006 PTFE ceramic-filled | – | 24 | 6,2 | – | 1 x 10^5 | 0,79 | 0,0020 | 500° | 1,2 |
Rogers RO3010 PTFE ceramic-filled | – | 16 | 10 | – | 1 x 10^5 | 0,95 | 0,0022 | 500° | 1,6 |
ARLON 85N Polyimide HTg | 250° | 55 | 4,2* | 57 | 1,6 x 10^9 | 0,20 | 0,0100* | 387° | 1,2 |
PCB Materials Suppliers
Properties of High-Frequency PCB
Reduced Signal Delay
No Discontinuity in Copper Layer
High Glass Transition Temperature
Minimal Attenuation
Low Moisture

Applications of High-Frequency PCB
Telecommunication Systems
Radars
Satellites
Wireless Controlled Devices
Speed Switching
Medical Machinery
Military Applications
Factors influencing a high frequency PCB Design
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The selection of PCB material for high-speed digital circuits is influenced by several factors. The high frequency PCB must offer following features apart from a good structural build-up. Impedance controlled multilayers
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Sandwich buildup for material combinations
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Controlled production line
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Signal loss tolerance
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Heat sinking ability
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Operating temperature(temperature expansion, stability over a temperature range)
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Production cost