Category: PCB Blog

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Causes of cold welding problems in PCB reflow soldering
What is cold welding?It refers to solder joints with incomplete reflow after SMT processing and welding,...
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DIP plug-in station assignment and its work content in FR4 board
DIP (Double In-line Package) is a kind of circuit assembly technology that places the front of through-hole...
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Formation mechanism and solution of BGA incomplete solder joint
low preheating temperature, low tin pot temperature, high solder copper content, flux failure or density...
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Electric soldering iron welding method in PCBA
In the case of small welding spot, the three-step method can also be used to complete the PCBA welding,...
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How to select high-frequency materials and high-speed materials
When selecting high frequency materials and high speed materials for PCB used in high frequency circuits,...
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Vibration test and impact test of PCB
Vibration test is an important part of PCBA test to assess the ability of products to withstand vibration...
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Structure and principle of wave soldering in PCB
At present, wave soldering is usually composed of PCB board? mounting system, flux coating system, preheating...
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Causes and Improvement of PCB Board Dry Film Damage or Penetration
The wiring of PCB board? is very precise, and many PCB manufacturers use dry film process to transfer...
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Problems needing attention in PCB fabrication
PCB board is an important basic assembly component of electronic equipment.
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Types of PCB board etching and commonly used etchants
Pre coat a layer of lead tin anti-corrosive layer on the copper foil to be retained on the PCB board,...
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