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Category: PCB Blog
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PCB Blog
Page 67
PCB Blog
Electronic Design
IC Substrate
Microwave Tech
PCB News
PCBA Tech
Several technologies to improve the lamination quality of PCB
Laminating is an important process in the manufacture of PCB multilayers. The control of lamination quality...
December 29, 2021
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Reasons for poor coating of PCB circuit board
1. Pinhole of PCB circuit board. The pinhole is due to hydrogen adsorbed on the surface of the plated...
December 29, 2021
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Factors Influencing the Appearance of PCB Board
With the rapid development of PCB board manufacturing technology, users are not only interested in the...
December 29, 2021
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Multilayer PCB board test technology
In complex multi-layer PCB board detection, two common methods are needle-bed test and double-probe or...
December 29, 2021
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PCB board design layout rate and design efficiency skills
The size and number of layers of the printed circuit boards need to be determined at the initial stage...
December 29, 2021
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Why use Immersion Gold PCB Board?
Printed circuit boardssurface treatment,Anti-oxidation, tin spray, lead-free tin spray, immersion gold,...
December 29, 2021
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Surface treatment and wet process for PCB manufacturing
Abrasives are the materials used to grind and brush the copper surface before cleaning the PCB surface,...
December 28, 2021
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Application of copper coating and nickel plating on PCB board
The coating of PCB boards varies according to the use of the boards. Here is a brief description of the...
December 28, 2021
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Classification of CEM-3 and FR-4 PCB Multilayer Material
A1 level multi-layer PCB material quality of this series of products has completely reached the world-class...
December 28, 2021
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Development of copper foil technology for PCB circuit board
Copper foil production was started in 1937 at the Anaconda Copper Refinery in the United States. The...
December 28, 2021
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